Production Process
We believe that transparency is necessary for long term partnerships. Below is our production process, if you need any additional information or have questions, let us know.
Engineering Preparation
(1) Data checking;
(2) Manufacturing feasibility evaluating;
(3) Manufacturing Instruction (MI) preparing.
Cut Sheet
Cut the Sheet of Copper-Clad Laminate (CCL) into the production panel according to actual manufacturing and utilization.
Conductive Patterns on Inner Layer Transferring
(1) Photo-imaging;
(2) Etching;
(3) Automatic Optical Inspection (AOI).
Lamination
(1) Brown Oxide for conductive patterns on inner layers;
(2) Lay-up;
(3) Pressing.
Drilling
Drill plated-through holes, non-plated through holes and slots.
P.T.H
Metalize the holes by using the method of chemical depositing copper plating on the walls of the hole.
Panel Plating
Increase and strengthen the copper plating on walls of holes by the method of electro-plating after the P.T.H process.
Conductive Patterns on Outer Layer Transferring
Photo-imaging desired layout on copper clad laminates.
Pattern Plating
Electro-plate the copper on the surface of the board and wall of the hole to reach the thickness requested, and then coat the etch resist (Copper-Tin Protection) on the conductive patterns.
Etching
The copper which was not coated by etch resist will be removed by etching. After the etch resist (Copper-Tin protection) will be stripped, the copper circuits are formed. The conducting areas and connections are now properly established.
AOI for Outer Layer
Scan the conductive patterns to determine the potential imperfections by comparing it with the original Gerber. All potential imperfections need to be verified or/and repaired.
Solder Mask
Coat mask over the bare copper except for mounting or/and testing.
(1) Silkscreen or Spraying;
(2) Exposure;
(3) Developing;
(4) Post-curing.
Legends Silk-Screen
Print the legends/characters for identifying components, test points, parts of the PCB, warning symbols, logos, and marks desired by the customer. This stands useful while customers' service and repair.
Surface Finishing
Protecting the exposed copper circuitry and to provide a solder-able surface when assembling (soldering) the components to the printed circuit board.
Profiling
Profile the production panel by routing, scoring, and beveling, etc. to get the customer's panel with the outline sizes desired.
Electrical Test
100% Electrical test is done using probe testers. Open and short circuit tests are performed to ensure functional reliability.
First Stop
100% Automatic Visual Inspection is done to examine any defect on the board appearance using a computerized system.
Packaging
All PCBs would be vacuum-packed with silica gel and humidity indicator.